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datashee t 1/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 09.aug.2013 rev.001 general purpose cmos logic ic quad 2-input hex inverter bu4069ub bu4069ubf bu4069ubfv general description bu4069ub, bu4069ubf, bu4069ubfv consist of six inverters. each inverter has a single stage and therefore it is suitable to apply to not only digital circuits but also cr oscillator circuits and crystal oscillator circuits. features ? low power consumption ? high noise immunity ? wide operating supply voltage range ? high input impedance ? high fan out ? 2 l-ttl inputs or 1 ls-ttl input can be directly driven pin configurations truth table key specifications ? operating supply voltage range: +3v to +16v ? input voltage range: 0v to v dd ? operating temperature range: -40c to +85c packages w(typ) x d(typ) x h(max) dip14 19.40mm x 6.50mm x 7.95mm sop14 8.70mm x 6.20mm x 1.71mm ssop-b14 5.00mm x 6.40mm x 1.35mm input output i o l h h l product structure: silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays dip14 bu4069ub sop14 bu4069ubf ssop-b14 bu4069ubfv i5 o6 i4 o5 o4 i6 vdd o2 i2 o3 i3 vss o1 i1 1 2 3 4 5 6 7 14 13 12 11 10 9 8
datasheet datasheet 2/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv pin descriptions absolute maximum ratings (note 1) reduce 9.5mw per 1c above 25c (note 2) mounted on 70mm x 70mm x 1.6mm gl ass epoxy board. reduce 4.5mw per 1c above 25c (note 3) mounted on 70mm x 70mm x 1.6mm gl ass epoxy board. reduce 7.0mw per 1c above 25c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. ther efore, it is important to consider circ uit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions pin no. pin name i/o function 1 i1 i input1 2 o1 o output1 3 i2 i input2 4 o2 o output2 5 i3 i input3 6 o3 o output3 7 vss - ground 8 o4 o output4 9 i4 i input4 10 o5 o output5 11 i5 i input5 12 o6 o output6 13 i6 i input6 14 vdd - power supply parameter symbol rating unit supply voltage v dd -0.3 to +18.0 v input voltage v in -0.3 to v dd +0.3 v input current i in 10 ma operating temperature topr -40 to +85 c storage temperature tstg -55 to +150 c maximum junction temperature tjmax +150 c power dissipation pd dip14 1.18 (note 1) w sop14 0.56 (note 2) ssop-b14 0.87 (note 3) parameter symbol rating unit supply voltage v dd +3.0 to +16.0 v input voltage v in 0 to v dd v
datasheet datasheet 3/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv electrical characteristics (unless otherwise specified, v ss =0v, ta=25c) dc characteristics parameter symbol limits unit conditions figure no. min typ max v dd [v] input ?h? voltage v ih 4.0 - - v 5 - 1 8.0 - - 10 2 12.0 - - 15 3 input ?l? voltage v il - - 1.0 v 5 - 1 - - 2.0 10 2 - - 2.5 15 3 input ?h? current i ih - - 0.3 a 15 v ih =15v - input ?l? current i il - - -0.3 a 15 v il =0v - output ?h? voltage v oh 4.95 - - v 5 i oh =0ma 1 9.95 - - 10 2 14.95 - - 15 3 output ?l? voltage v ol - - 0.05 v 5 i ol =0ma 1 - - 0.05 10 2 - - 0.05 15 3 output ?h? current i oh -0.44 - - ma 5 v oh =4.6v 4 -1.1 - - 10 v oh =9.5v -3.0 - - 15 v oh =13.5v output ?l? current i ol 0.44 - - ma 5 v ol =0.4v 5 1.1 - - 10 v ol =0.5v 3.0 - - 15 v ol =1.5v quiescent supply current i dd - - 1 a 5 v in =v dd or v ss - - - 2 10 - - 4 15 switching characteristics parameter symbol limits unit conditions figure no. min typ max v dd [v] output rising time t tlh - 180 - ns 5 c l =50pf 6 - 90 - 10 - 65 - 15 output falling time t thl - 100 - ns 5 c l =50pf 7 - 50 - 10 - 40 - 15 ?l? to ?h? propagation delay time t plh - 90 - ns 5 c l =50pf 8 - 50 - 10 - 40 - 15 ?h? to ?l? propagation delay time t phl - 65 - ns 5 c l =50pf 9 - 40 - 10 - 30 - 15 input capacitance c in - 5 - pf - - -
datasheet datasheet 4/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv test circuits (one inverter circuit only) v v ih v ol 1 . v ih v v oh 2.v il 3 . v oh 4.v ol i oh 5 . i oh 6.i ol a v oh i ol a v ol v il v il v ih v ih v il + + vv oh i oh + vv ol i ol + + + description of symbols t phl : time from 50% of the rise edge of input waveform to 50% of the fall edge of output waveform t plh : time from 50% of the fall edge of input waveform to 50% of the rise edge of output waveform t thl : time from 90% to 10% of fall edge of output waveform t tlh : time from 10% to 90% of rise edge of output waveform input output 20ns 20 ns 90 % 50 % 10 % 90 % 50 % 10 % t plh t thl t tlh t phl c l =50pf 7. t tlh , t thl , t plh , t phl input output
datasheet datasheet 5/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv typical performance curves figure 1. output voltage vs input voltage v dd =5v / v ss =0v figure 2. output voltage vs input voltage v dd =10v / v ss =0v figure 3. output voltage vs input voltage v dd =15v / v ss =0v figure 4. output ?h? current vs output voltage 0 5 10 15 20 051 01 5 input voltage [v] output voltage [v] 85c 25c -40c 0 5 10 15 20 0 5 10 15 input voltag e [v] output voltage [v] 85c 25c -40c 0 10 20 30 40 50 0 5 10 15 20 output voltage [v] output "l" current [ma] 85c 25c -40c output voltage [v] -50 -40 -30 -20 -10 0 0 5 10 15 20 output voltage [v] output "h" current [ma] -40 25 85 v dd =10v 85 -40 25 -40 25 85 v dd =5v v dd =15v
datasheet datasheet 6/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv typical performance curves - continued figure 5. output ?l? current vs output voltage figure 6. output rising time t tlh figure 7. output falling time t thl figure 8. ?l? to ?h? propagation delay time t plh 0 100 200 300 400 500 -50 -25 0 25 50 75 100 ambient temperature [c] output fall time [ns] v dd =3v v dd =5v v dd =18v v dd =10v operating temperature range 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] v dd =3v v dd =5v v dd =18v v dd =10v operating temperature range 0 10 20 30 40 50 0 5 10 15 20 output voltage [v] output "l" current [ma] -40c 85c 25c -40c v dd =15v v dd =5v 85c 25c -40c v dd =10v 85c 25c 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 ambient temperature [c] output rise time [ns] operating temperature range v dd =3v v dd =5v v dd =18v v dd =10v
datasheet datasheet 7/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv typical performance curves - continued power dissipation power dissipation(total loss) indicates the power that can be consumed by ic at ta=25c(normal temperature). ic is heated when it consumed power, and the temperature of ic chip becomes higher than ambient temperature. the temperature that can be accepted by ic chip depends on circuit configurati on, manufacturing process, and consumable power is limited. power dissipation is determined by the temperature allowed in ic chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). the maximu m junction temperature is typically equal to the maximum value in the storage temperat ure range. heat generated by c onsumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja (c/w).the temperature of ic inside the package can be estimated by this thermal resistance. figure 10 shows the model of thermal resistance of the package. thermal resistance ja, ambient temperature ta, maximum junction temperature tjmax, and power dissipation pd can be calculated by the equation below: ja = (tjmax-ta) / pd (c/w) derating curve in figure 11 indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 9. ?h? to ?l? propagation delay time t phl 0 50 100 150 200 250 300 350 400 -50-25 0 25 50 75100 ambient temperature [c] propagation delay time [ns] v dd =3v v dd =5v v dd =18v v dd =10v operating temperature range figure 11. derating curve figure 10. thermal resistance ?? ta [ ] ??? tj [ ] M p [w] ambient temperature ta ( ) chip surface temperature tj ( ) power dissipation pd (w) ja=(tjmax-ta)/pd (c/w) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] bu4069ub (dip14) bu4069ubf ( sop14 ) 85 bu4069ubfv(ssop-b14)
datasheet datasheet 8/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv i/o equivalence circuit port number input ports output ports 1,3,5,9,11,13 2,4,6,8,10,12 equivalence circuit operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling ca pacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. vd d gnd vd d gnd vd d vd d gnd gnd vss vss vss vss vdd vdd vdd vdd
datasheet datasheet 9/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv operational notes - continued 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others.
datasheet datasheet 10/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv ordering information b u 4 0 6 9 u b x x - e 2 part number. package none : dip14 f : sop14 fv : ssop-b14 packaging and forming specification none : tube e2 : embossed tape and reel marking diagrams sop14(top view) bu4069ubf part number marking lot number 1pin mark dip14 (top view) bu4069ub part number marking lot number ssop-b14(top view) 4069u part number marking lot number 1pin mark
datasheet datasheet 11/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv physical dimensions tape and reel information package name dip14
datasheet datasheet 12/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv physical dimension, tape and reel information ? continued package name sop14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr))
datasheet datasheet 13/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv physical dimension, tape and reel information ? continued package name ssop-b14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet datasheet 14/14 tsz02201-0rdr1gz00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 09.aug.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 bu4069ub bu4069ubf bu4069ubfv revision history date revision changes 09.aug.2013 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu4069ub package dip14 unit quantity 1000 minimum package quantity 25 packing type tube constitution materials list inquiry rohs yes bu4069ub - web page distribution inventory

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